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Volume recovery of the SMP foams was found to be acceptable for device incorporation. The performance metrics tested are: programmed resistance levels. Then the effect of the connecting wires resistance in phase change memory (PCM) performance in PCM-based passive nanocrossbar was evaluated. Pore size ratios show similar results indicating very little difference between the bulk and adhered foam. In this study, the resistance of connecting wire as a function of material properties and feature size is calculated. Density ratios of foam adjacent to the wire in comparison to the bulk foam are uniform, signifying little change in foam density. Results have shown successful adhesion and low foam densities in the vicinity of the wire. The process of adhering the foam to nitinol wire during foam fabrication culminated in a formalized standard used to synthesize SMP foams onto nitinol wires. Foam chemistry was slightly altered to make lower viscosity solutions to enable the foaming over the necessary length of wire. The synthesis of SMP foams onto a backbone wire was achieved by selecting and optimizing a coating used on the nitinol wire to ensure proper foam-wire adhesion.
![wire library memory wire library memory](http://www.14core.com/wp-content/uploads/2017/03/24C256-EEPROM-Wiring-Diagram-Schematics-Manual-Guide-14core.jpg)
The key parameters for this project were to achieve substantial adhesion to the wire without disrupting the foams’ physical and chemical properties in the vicinity of the backbone wire.
#Wire library memory serial
I2C is a two wire interface using the SDA (Serial Data Line) and SCL (Serial Clock Line) pins to communicate over the serial bus. The library inherits from the Stream functions, making it consistent with other read/write libraries. This procedure is tedious, time consuming, and has substantial issues regarding foam slippage along the backbone wire. This library allows you to communicate with I2C / TWI devices. This work was completed to streamline the current device fabrication protocol, which includes crimping the shape memory polymer over the backbone wire and fixing it in place with epoxy on the proximal and distal ends. This device seeks to improve upon current methods of endovascular treatment for intracranial aneurysms. The Biomedical Device Lab (BDL) is developing a new type of cerebral aneurysm embolization device that incorporates a high volume filling shape memory polymer foam onto a shape set nickel titanium (nitinol) backbone. In this work, the synthesis of ultra-low density Shape Memory Polymer (SMP) foams onto a nickel-titanium backbone wire is achieved, optimized, and characterized for the use in an intracranial aneurysm embolization device.